Job Detail

Principal Packaging Engineer

Principal Packaging Engineer

ARM

Austin, TX

Job ID : 374f2f7156306c376d5146382f744f3645773d3d

Job Description :

Job Description

Arm has a phenomenal opportunity for a Principal Packaging Engineer in our System Integration team. You will work closely with IP, SoC Design, Package Design, Signal Integrity, Power Integrity, Test and Systems teams throughout the company, to guide development of innovative packaging solutions within Arm. You will play a key role in identifying key packaging technologies, establishing 3rd party relationships, communicating with partners and addressing challenges in areas such as 2.5D/3DIC and sub-3nm nodes. The role requires passionate engineering focus in package design, assembly yield analysis, die-to-die interfaces and manufacturing technologies.

Responsibilities:
  • Identifying innovative technologies that maximize the performance of Arm architectures
  • Working closely with internal and external customer partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
  • Identifying critical elements for Arm’s packaging roadmap and disseminate these use strategies to key stakeholders
  • Driving design strategies for performance and manufacturability in packaging
  • Working closely with external partners for driving successful assembly prototypes

Required Skills & Experience:

  • Bachelors, Masters, or Ph.D. degree in Electrical Engineering or Mechanical Engineering
  • Expertise in 2.xD, 3D and other chiplet packaging methodologies
  • A strong understanding of package failure mechanisms and causes
  • Expertise in package standards
  • Depth of knowledge in memory interfaces such as HBM3, GDDRR6, etc.
  • Experience with advanced multichip system-in-package
  • Minimum 5 years of experience in package engineering, including advanced multichip system-in-package work
  • Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators.
  • Knowledge of signal integrity and power integrity principles would be a benefit

In Return

Arm® technology is at the heart of a computing and connectivity revolution that is redefining the way people live and businesses operate. From the unmissable to the invisible; our sophisticated, energy-efficient processor designs are enabling the intelligence in 86 billion silicon chips and securely powering products from the sensor to the smartphone to the supercomputer. With more than 1,000 technology partners including the world’s most famous business and consumer brands, we are driving Arm innovation into all areas compute is happening inside the chip, the network and the cloud.

With offices around the world, Arm is a diverse community of dedicated, innovative and highly talented professionals. By enabling an inclusive, meritocratic and open workplace where all our people can grow and succeed, we encourage our people to share their unique contributions to Arm's success in the global marketplace.

We are an Equal Opportunity Employer and do not discriminate against any employee or applicant for employment because of race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, and basis of disability or any other federal, state or local protected class. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.

#LI-AC1

Company Details :

Name : ARM

CEO : Rene Haas

Headquarter : Cambridge, United Kingdom

Revenue : $1 to $5 billion (USD)

Size : 5001 to 10000 Employees

Type : Company - Private

Primary Industry : Computer Hardware Development

Sector Name : Information Technology

Year Founded : 1990

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Details

: Austin, TX

: 111380 - 156487 USD ANNUAL

: Today

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